Freescale, Dongfeng Motor to Jointly Develop Auto Body Electronics, Powertrain Control, HEV Tech
February 4, 2009 // Published as a news service by IHS
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Dongfeng Motor Corp. and Freescale Semiconductor will establish an automotive electronics lab in China aimed at jointly developing silicon, software and system-level tools to be used in the next generation of Dongfeng Motor vehicles for both China and export markets.
According to Freescale Semiconductor, the two companies intend to cooperate in developing automotive applications, including body electronics, powertrain control and hybrid electric vehicle (HEV) technologies.
Future cooperation between the two companies is expected to focus on chassis and safety technologies, as well as in-car infotainment and navigation.
The companies also plan to jointly develop underlying software and hardware platforms for electronic control units (ECUs), modeling tools, demonstration panels, automotive open system architecture (AUTOSAR) applications, in-vehicle networking tools and low-end body control modules.
The technical cooperation involves a series of Freescale microcontroller (MCU) platforms, including 32 b Power Architecture MCUs, 16 b S12X and 8 b S08 devices, as well as analog integrated circuits (ICs).
"Through close cooperation and joint research and development, Freescale and Dongfeng Motor expect to achieve breakthroughs in cost-effective body electronics, powertrain and HEV solutions to be deployed in next-generation automotive system designs," said Henri Richard, Freescale senior vice president, chief sales and marketing officer.
To date, Dongfeng has developed advanced technologies for engine control, hybrid control and automated manual transmission (AMT). Dongfeng's ECU development project, based on the Freescale S12 MCU, has gone into mass production.
Source: Freescale Semiconductor Inc.